Gratings produced by two-spherical-beam Laser Interference Lithography (LIL) will have a nonuniform period, and the associated period variation is larger with the increase of the substrate size. This work quantitatively investigates a noninvasive method for improving the period variation on 4-inch silicon wafers. By temporarily deforming the flexible silicon wafer using a customized concave vacuum chuck [ J. Vac. Sci. Technol. B 19 ( 6 ), 2347 ( 2001 ) 10.1116/1.1421558 ], we show that the fabricated gratings will have improved period uniformity, with the period variation reduced by 86% at the 1000 nm central grating period setting. This process is a simple and efficient way to achieve linear gratings without altering the LIL configuration with two spherical beams. We present experimental results on the impact of a concave vacuum chuck on the chirp reduction at different grating period settings. Then, we compare two different LIL configurations with different wavelength sources concerning their influence on the efficiency of period variation reduction. Finally, the flatness of the 4-inch silicon wafers due to the temporary bending process is verified using optical profilometry measurements.